october 2011 doc id 18247 rev 1 1/9 9 STPS1L40-Y automotive low drop power schottky rectifier features very small conduction losses negligible switching losses low forward voltage drop surface mount miniature packages avalanche capability specified aec-q101 qualified ecopack ? 2 compliant components description single chip schottky rectif iers suited to switched mode power supplies and high frequency dc to dc converters. packaged in sma and smb this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection in automotive applications. table 1. device summary symbol value i f(av) 1 a v rrm 40 v t j (max) 150 c v f (max) 0.42 v smb (jedec do-214aa) stps1l40uy sma (jedec do-214ac) stps1l40ay k a k a www.st.com
characteristics STPS1L40-Y 2/9 doc id 18247 rev 1 1 characteristics to evaluate the conduction losses use the following equation: p = 0.23 x i f(av) + 0.19 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 40 v i f(rms) forward rms current 8 a i f(av) average forward current t l = 130 c = 0.5 1 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 60 a i rrm repetitive peak reverse current t p = 2 s f = 1 khz square 1 a i rsm non repetitive peak reverse current t p = 100 s square 1 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 900 w t stg storage temperature range - 65 to + 150 c t j operating junction temperature range (1) 1. condition to avoid thermal runaway for a diode on its own heatsink -40 to + 150 c dv/dt critical rate of rise of reverse voltage 10000 v/s table 3. thermal resistance symbol parameter value unit r th(j-l) junction to lead sma 30 c/w smb 25 table 4. static electrical characteristics symbol parameter tests conditions min. typ. max. unit i r (1) 1. pulse test: t p = 380 s, < 2% reverse leakage current t j = 25 c v r = v rrm - - 35 a t j = 125 c - 6 10 ma v f (1) forward voltage drop t j = 25 c i f = 1 a --0.5 v t j = 125 c - 0.37 0.42 t j = 25 c i f = 2 a - - 0.63 t j = 125 c - 0.5 0.61 dptot dtj < 1 rth(j-a)
STPS1L40-Y characteristics doc id 18247 rev 1 3/9 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature (sma, = 0.5) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 t = t p /t t p p f(av) (w) i f(av) (a) = 0.05 = 0.1 = 0.2 = 0.5 = 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 25 50 75 100 125 r th(j-a) = r th(j-l) r th(j-a) = 120 c/w sma i f(av) (a) t amb (c) 150 t = t p /t t p figure 3. average forward current versus ambient temperature (smb, = 0.5) figure 4. normalized avalanche power derating versus pulse duration 0. 0 0. 2 0. 4 0. 6 0. 8 1. 0 1. 2 0 25 50 75 100 125 150 i f(av) (a) t = t p /t t p t amb (c) smb r th(j-a) = r th(j-l) r th(j-a) = 100 c/w 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t p ) p (1 s) arm arm figure 5. normalized avalanche power derating versus junction temperature figure 6. non repetitive surge peak forward current versus overload duration (maximum values, sma) 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t j ) p (25 c) arm arm 0 1 2 3 4 5 6 7 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 i m t = 0.5 t(s) i m (a) sma t a = 25 c t a = 75 c t a = 125 c
characteristics STPS1L40-Y 4/9 doc id 18247 rev 1 figure 7. non repetitive surge peak forward current versus overload duration (maximum values, smb) figure 8. relative variation of thermal impedance junction to ambient versus pulse duration (sma) 0 1 2 3 4 5 6 7 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 i m (a) i m t = 0.5 t a = 25 c t a = 75 c t a = 125 c smb 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 single pulse sma z th(j-a) /r th(j-a) t p (s) epoxy printed circuit board, copper thickness = 35 m, recommended pad layout figure 9. relative variation of thermal impedance junction to ambient versus pulse duration (smb) figure 10. reverse leakage current versus reverse voltage applied (typical values) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z th(j-a) /r th(j-a) single pulse smb t p (s) epoxy printed circuit board, copper thickness = 35 m, recommended pad layout 1.e-03 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 5 10 15 20 25 30 35 40 v r (v) i r (ma) t j = 25 c t j = 50 c t j = 75 c t j = 125 c t j = 150 c t j = 100 c figure 11. junction capacitance versus reverse voltage applied (typical values) figure 12. forward voltage drop versus forward current (typical values, high level) 10 100 1000 1 10 100 v r (v) c(pf) f = 1 mhz v osc = 30 mv rms t j = 25 c 0.01 0.10 1.00 10.00 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 t j = 125 c t j = 25 c v fm (v) i fm (a)
STPS1L40-Y characteristics doc id 18247 rev 1 5/9 figure 15. thermal resistance junction to ambient versus copper surface under each lead (smb) figure 13. forward voltage drop versus forward current (typical values, low level) figure 14. thermal resistance junction to ambient versus copper surface under each lead (sma) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 i fm (a) v fm (v) t j = 125 c t j = 25 c 0 20 40 60 80 100 120 140 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5. 0 r th(j-a) (c/w) s cu (cm2) sma epoxy printed circuit board, fr4 copper thickness = 35 m 0 20 40 60 80 100 120 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 s cu (cm2) r th(j-a) (c/w) smb epoxy printed circuit board, fr4 copper thickness = 35 m
package information STPS1L40-Y 6/9 doc id 18247 rev 1 2 package information epoxy meets ul94, v0 cathode band (sma, smb) in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 16. footprint, dimensions in mm (inches) table 5. sma dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.094 a2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.90 0.089 0.114 e 4.80 5.35 0.189 0.211 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 e c l e1 d a1 a2 b 2.63 (0.103) 5.43 (0.214) 1.4 1.64 (0.064) 1.4 (0.055) (0.055)
STPS1L40-Y package information doc id 18247 rev 1 7/9 figure 17. footprint, dimensions in mm (inches) table 6. smb dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 l 0.75 1.50 0.030 0.059 e c l e1 d a1 a2 b 2.60 5.84 1.62 2.18 1.62 (0.064) (0.102) (0.300) (0.064) (0.086)
ordering information STPS1L40-Y 8/9 doc id 18247 rev 1 3 ordering information 4 revision history table 7. ordering information order code marking package weight base qty delivery mode stps1l40ay gb4y sma 0.068 g 5000 tape and reel stps1l40uy gc4y smb 0.107 g 2500 tape and reel table 8. document revision history date revision changes 21-oct-2011 1 first issue.
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